Silicone Rubber Thermally Conductive Insulation Pad has an ideal filler blend that gives low-modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.
Computer and peripherals
?DRAMTM memory modules/chip scale packages
?rea where heat needs to be transferred to a frame,
?hassis, or other type of heat spreader
Specification: Thickness 0.5.mm1mm1.5mm2mm2.5mm3.0mm3.5mm4.0mm4.5mm.5.0mm.
Note: color and back adhesive can be optional by customers.
Application: it can be applied in a variety kind of electronics for heat radiation and insulation, such as: CD-ROM, computer, power supplier, LED etc.